USB 3.0 a principios del 2010

De nuevo volvemos a tener noticias sobre el nuevo estandar USB 3.0. Y es que Jim Choate, portavoz de Agilent Technologies Inc., anunció hace unos días en Tokio (Japón) que su versión final estará lista para el mes de junio, momento a partir del cual el USB Implementers Forum tendrá que regular su implementación en los dispositivos de los diferentes fabricantes interesados -esta organización se encarga, entre otras cosas, de su programa de certificación-.

¿Y eso qué siginifica? Pues que al menos habrá que esperar hasta finales de 2009 para que todo esté listo. De esta manera, según confirma el propio Jim, será a primeros del 2010 cuando veamos los primeros productos que cumplan con esta nueva especificación y disfrutar así de todas sus virtudes.

Se estima que para esta fecha se realizará el lanzamiento de USB 3.0 para los fabricantes; luego de ello los fabricantes deberán realizar gran cantidad de pruebas para poder incluir esta tecnología en sus productos.

Estas pruebas se realizarán aproximadamente después de la segunda mitad de 2009, por lo que finalmente se comenzará a observar en el mercado productos con USB 3.0 a principios de 2010. Ni hablar del tiempo que deberá pasar para que se adapte al mercado, ya que al momento de ser lanzado el producto todavía se va a encontrar verde.

lE futuro USB 3.0 ha llegado con increibles y necesarias mejoras, algunas de estas son:

La empresa Symwave ha presentado un demo de su chipset Quasar, que permite sincronizar teléfonos y reproductores, además no será hasta el 2010 que sea presentado oficialmente con todas sus caracteristicas.

Posted on May 14, 2009
Tags: USB 3.0 SuperSpeed

Intel USB 3.0, la especificaciones están al caer

Parece ser que será este mismo 17 de Noviembre cuando, dentro del marco del USB Implementers Forum, se celebrará la conferencia de desarrolladores del SuperSpeed USB, más conocido como USB 3.0. Está previsto que en dicha conferencia sea donde se desvelen las especificaciones completas del nuevo estándar que empezaremos a ver implementado a partir de 2009.

Después de casi 9 años con el USB 2.0 liderando las conexiones de prácticamente todos los aparatos de electrónica de consumo, y viendo las velocidades que están alcanzando otros protocolos de transmisión de datos como el Wi-Fi, bien hacía falta una actualización en dicho sistema.

El nuevo USB 3.0 está diseñado para que pueda alcanzar velocidades 10 veces superiores al actual USB 2.0, lo que vienen a ser unos 4.8 Gbit por segundo, con una transferencia teórica máxima de 600 MB por segundo.

Y bueno, después de que Intel y Nvidia resolvieran sus pequeñas diferencias producto de la reticencia de los primeros a pasar las especificaciones a “cualquiera que compita con nosotros fabricando CPUs y Chipsets”, parece ser que a partir de Enero empezaremos a ver ordenadores con el nuevo conector, lo que deja a todo el mundo con un ordenador comprado anteriormente en el ya habitual retraso al que nos tiene acostumbrado esto de las nuevas tecnologías.

Fuente: CNET

Posted on May 14, 2009
Tags: USB 3.0 SuperSpeed

Chinese Retailer Welcomes Obama With Burger USB Drive

A Chinese web site is selling a hamburger USB drive, among other gadgets, to welcome the new president of the United States.

ActFind, the same Chinese retailer we ordered a fake iPhone from, is offering about 60 items marketed as “New arrival for new USA president!” Unfortunately, I think the hamburger drive is the only gadget that can be stretched to have anything to do with the United States. (The rest of the product line is pretty random: netbooks, Nintendo DS, a Hello Kitty mouse, etc.)

The burger drive has a 2GB capacity and appears to contain cheese, pastrami and a leaf of rancid lettuce. Scattered on top of the bun are about 10 disproportionately large seeds. Déliceux.

Here’s the other thing that screams U.S.A. about this gadget: You can only order it in bulk. Ten pieces, to be precise, for $90. And Americans just love buying stuff in bulk, right? Put me down for 70!

Posted on December 17, 2008
Tags: USB 3.0 SuperSpeed

Asus Already Looking to USB 3.0

USB 3.0 could take off fast. We believe that the connectors were shown for the first time publicly at this year’s CES, and at least one manufacturer is already working the spec into their laptops. Eagle-eyed scouts at The Register spotted two USB 3.0-like ports in the Asus’ M50 laptop. But it’s sort of complicated. The transition of USB 2.0 to USB 3.0 will increase the number of wire contacts from 4 to 5. The Register spotted ports that made room for the fifth wire contact but still sported only four, meaning that Asus was framing their system for USB 3.0 even though they weren’t technically adopting the spec just yet. Given that USB 3.0 will bring data transfers up to 4.7GB/sec, we’re fine with companies pushing this technology onto us.

Source

Posted on December 17, 2008
Tags: USB 3.0 SuperSpeed

Super Talent to Begin Shipping “The Godfather” USB Flash Drives this Month

San Jose, California – December 2, 2008 – Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced that the firm has signed a licensing agreement with Paramount Licensing Inc. granting rights to manufacture and market USB Flash drives based on Paramount Pictures movie title, “The Godfather.”

The company expects to begin shipping its first GODFATHER USB Flash drives this month, which will be preloaded with memorable quotes and still photos from the feature film. Additional new models based on “The Godfather” theme will follow in 2009.

Super Talent Director of Marketing, Joe James explained, “The introduction of movie-themed USB drives marks the beginning of a new era for the Flash industry. These drives will capture the spirit of ‘The Godfather,’ and will be a sure hit with millions of Don Corleone fans.”

“’The Godfather’ is one of the most iconic Hollywood films ever, and is a fitting property to help launch this new product category in the licensing industry. We are very excited to be working with Super Talent on this innovative product launch,” said Michael Corcoran, President, Paramount Consumer Products and Recreation Group.

About Super Talent Technology Corporation

Super Talent Technology, based in San Jose, California, designs and manufactures a full range of DDR, DDR2, and DDR3 memory modules and Flash based storage devices for computers and consumer electronics. An ISO 9001 certified company, Super Talent utilizes its state-of-the-art factory and leading-edge components to produce award-winning products with outstanding reliability. Super Talent is an active member of the JEDEC and ONFI standards bodies, and holds over 200 patents in Flash and DRAM technology.

About Paramount Licensing Inc.

Paramount Licensing handles licensing rights worldwide for properties of Paramount Pictures, Paramount Vantage, Paramount Classics, MTV Films, Nickelodeon Movies and DreamWorks Studios. Paramount Licensing has established robust licensing programs for Paramount’s extensive library of films and current releases through merchandise, stage plays, publishing, and recreation programs. Visit Paramount Licensing at www.paramountlicensing.com.

Paramount is a registered trademark of Paramount Pictures Inc.

SOURCE

Posted on December 3, 2008
Tags: USB 3.0 SuperSpeed

USB 3.0 Demos Feature 450MBps Speed, Non-compressed HDTV Transmission

A number of companies demonstrated USB 3.0 (SuperSpeed USB) data transmissions using prototype circuits at the SuperSpeed USB Developers Conference, a meeting for developers that took place in San Jose, California, from Nov 17 to 18, 2008.

Especially, they were demonstrated by IP core vendors in an effort to sell prototypes to developers as FPGA-based systems for development and verification. Though no company has developed a system that uses a USB 3.0 cable or connector, the level of completion is gradually increasing.

PLDA demos 450 Mbytes per second

Fresco Logic Inc prototyped IP cores for USB 3.0 hosts and device controllers and exhibited them as an FPGA-based demo system. The company displayed data transmissions using this system at the IDF (Intel Developer Forum), which took place in San Francisco in August 2008 (See related article).

This time, Fresco Logic improved the technology by, for example, using a coaxial cable for communications between the host and the device. The company can ship the system if requested, it said.

PLDA Inc of France also exhibited a prototype system that drives a USB 3.0 IP core on an FPGA board. The company proved on a monitor that the system can achieve an effective data transmission speed of more than 450 Mbytes per second. PLDA is ready to ship the system as a product, too, it said.

Synopsys Inc prototyped an HDTV video transmission system based on USB 3.0 and demonstrated a transmission of non-compressed 1080p 30fps HDTV video via USB 3.0. Its effective data transfer rate surpasses 450 Mbytes per second, the company said.

Synopsys is planning to add the IP used in this system to its “DesignWare” IP core and verification IP series lineup as the “DesignWare SuperSpeed USB IP” and to start shipping it in the second half of 2009.

At this year’s SuperSpeed USB Developers Conference, which was attended by about 500 engineers and marketing people, a large number of attendees packed into the room where the prototype systems were exhibited. According to USB-IF’s spokesperson, the turnout far exceeded the previous record for attendance at any USB-related meeting for developers.

Fresco Logic’s prototype system

PLDA’s development platform

SOURCE

Posted on December 1, 2008
Tags: USB 3.0 SuperSpeed

Agilent Technologies Announces USB 3.0 SuperSpeed Physical Layer Compliance Test Application

At the first USB 3.0 Developers Conference in San Jose, Calif., Agilent demonstrated its new USB 3.0 transmitter and USB 3.0 receiver compliance test solutions. This demonstration included the industry’s first USB 3.0 signal quality test fixture. The complete solution enables engineers to quickly and accurately test their USB 3.0 designs.
Agilent’s solution will incorporate the final USB 3.0 specification announced by the USB-IF on Nov. 14. USB 3.0, known as “SuperSpeed USB” will deliver 10 times the data transfer rate of USB 2.0 and make power usage more efficient. SuperSpeed USB will be necessary for data-storage devices transferring more than 25 Gbps. Industry experts expect manufacturers to adopt SuperSpeed USB by the end of 2009 and to have consumer products widely available in 2010. However, until the actual silicon is available for testing, no USB solution will be ready for official certification.
“We are working closely with the developers of the SuperSpeed USB technology to make sure our solution completely meets the needs of engineers testing for USB 3.0 compliance,” said Scott Sampl, general manager of Agilent’s oscilloscope business. “To further improve the Agilent SuperSpeed USB 3.0 solution, we are collaborating with beta partners.”
Agilent’s complete design, simulation and testing solution includes:
– Infiniium DSO/DSA91304A 13-GHz oscilloscope for transmitter testing;
– Agilent USB 3.0 transmitter compliance test application;
– Agilent USB 3.0 test fixtures;
– J-BERT N4903A, a high-performance serial BERT with complete jitter tolerance test for characterizing USB 3.0 SuperSpeed serial communication links;
– Agilent ADS simulation software for creating and analyzing USB 3.0 channels;
– Agilent VNA/PNA network analyzer N5230C-245 for measuring and analyzing USB 3.0 channels.
Additional information about Agilent’s USB compliance test solution is available at www.agilent.com/find/N5416A.
Agilent’s complete portfolio of oscilloscopes is available in a variety of form factors, from 20 MHz to 90 GHz, offering industry-leading specifications and powerful applications.
U.S. Pricing and Availability
The Agilent USB 3.0 transmitter compliance test application and the USB 3.0 signal quality test fixture will be released once the official silicon is available for certification, which is expected in February 2009.
About Agilent Technologies.
SOURCE

Posted on November 27, 2008
Tags: SUPERSPEED

Cadence Announces Verification IP for USB 3.0 and PCI Express 3.0 Protocols

Cadence Design Systems has announced the development of Open Verification Methodology (OVM) verification IP (VIP) for USB 3.0 and PCI Express 3.0 high speed protocols.
Cadence has stated that their VIP now supports more than 30 protocols, including the most commonly requested ones such as PCI Express, Ethernet, USB, and SATA, meaning that Cadence offers a decent selection of VIP available.
Customers can use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems.
Officials say that Cadence VIP simplifies the overall verification development and integration process for design and verification teams that are developing OVM-based test benches using an automated metric-driven approach. Included with the VIP is the unique compliance management system (CMS), which automates compliance verification - one of the key benefits of the metric-driven approach. CMS is said to ease the process protocol compliance verification and the incorporated management capability can reduce resources and skill needed for verification closure.
“The need for metric-driven highly automated OVM VIP is clearly growing, and Cadence is investing significantly to satisfy this demand and deliver VIP to the early protocol adopters at the earliest possible time,” said Dave Tokic, director of product marketing at Cadence. “Verification teams benefit from the depth of Cadence’s VIP portfolio for verifying compliance to leading-edge protocols. We are confident that our new products for SuperSpeed USB and PCI Express 3.0 will go a long way in providing these engineers with the productivity, predictability and quality they are seeking.”
USB 3.0 is a SuperSpeed USB personal interconnect that can deliver over 10 times the speed of today’s connection. PCI Express 3.0 is the next evolution of the ubiquitous and general-purpose PCI Express I/O standard. At 8GT/s bit rate, the interconnect performance bandwidth is doubled over PCIe 2.0, while preserving compatibility with software and mechanical interfaces. And analysts say Cadence verification IP can accelerate the delivery of USB 3.0 and PCIe 3.0 protocol-compliant IP and System-on-Chips to the market.
Cadence also provides a comprehensive set of VIP classes applicable to block, module, chip and system level verification. This includes assertion-based and transaction-based acceleration and emulation rate adapters, which are branded as Cadence SpeedBridge products.
SOURCE

Posted on November 27, 2008
Tags: USB 3.0 SuperSpeed

USB 3.0 gives Superspeed boost

The USB 3.0 Implementers Forum (USB-IF) has announced the final spec for the next generation of USB connections, backed by industry heavyweights including HP, Intel and Microsoft.

The new standard, referred to as SuperSpeed USB, offers two key advantages over the current USB2.0 technology. It can theoretically support data-transfer speeds of up to 4.8Gbps - ten times the speed provided by USB 2.0 – and is also likely to be more power-efficient.

Jeff Ravencraft, the president of the USB-IF, the industry group that promotes USB technology, said: ‘Today’s consumers are using rich media and large digital files that need to be easily and quickly transferred from PCs to devices and vice versa. SuperSpeed USB meets the needs of everyone, from the tech-savvy executive to the average home user.’

USB 3.0 compatible with existing gadgets

Consumers won’t have to buy new products as USB 3.0 will offer backwards compatibility with the billions of USB PCs, Macs and peripherals already in use.These include devices such as memory sticks, flash drives, hubs, modems, sound cards, as well as more specialised gadgets such as turntables, drum kits and microscopes.

USB is the principal connection for most common electronics products, including MP3 players, digital cameras, photo printers, mobile phones and digital photo frames.

Which? technology expert Al Warman said: ‘as consumers create ever larger amounts of digital data, whether music, video or photos, the speed at which they can transfer this data needs to keep pace. USB 3.0 is the next step in this evolutionary process.’

The USB-IF anticipates that USB 3.0 will start to appear in computers from the second half of 2009, with consumer products following in 2010.

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SOURCE

Posted on November 24, 2008
Tags: SUPERSPEED, Technology

SuperSpeed USB 3.0 Spec Finalized: It’s Fast

We already know most of what there is to know about USB 3.0—officially dubbed SuperSpeed USB—but today it’s officially set in stone. To recap, with transfer speeds of 4.8Gbps, it’ll dump a 25GB HD file in about 70 seconds, and the architecture has been beefed up with extra data lanes to make for more sustained, rather than bursty transfer speeds, making it better for camcorders and the like. Even though it delivers more power than USB 2.0 to charge gadgets faster (and it’ll revive a completely dead one too), its new polling architecture makes it more efficient.

The one bad bit of news is that your old USB cables won’t deliver SuperSpeeds—you’ll have to have USB 3.0 gear from end-to-end to get the ridiculous transfer rates because the cables have extra pins for data, though it is all backward compatible. On the cable front you’ve got three plugs: Standard A (which looks like the one you know and love), standard B (the square one), mini B (which looks like a bizarre double-headed monster) and micro. We should start seeing the first USB 3.0-equipped gadgets sometime in 2010, though mayyyybe by the end of 2009 if we’re lucky. [USB]

Posted on November 24, 2008
Tags: Technology, USB 3.0 SuperSpeed

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